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Proudly Serving Researchers Since 1997.
Ultra-Thin Silicon Wafers Soitec Silicon on Insulator Wafers
E-Beam Evaporated Metals

Our E-Beam evaporation process provides excellent film thickness control and can deposit up to six different materials in-situ. E-Beam evaporation is often used when precious metals deposition is required and is an excellent choice for wafers that require lift-off processing.

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In order to ensure the best results for metal lift-off, the underlying wafer and photoresist must be kept cool during metal deposition. This can be difficult to achieve while depositing thick layers. We along with our partners Micro-devices has developed a specialized low temperature E-Beam evaporation process specifically for use during metal lift-off processing.
The surface preparation of patterned silicon and quartz wafers intended for lift-off metal is also extremely important. We include photo-resist bake and O2 descum steps just prior to deposition to improve film adhesion.
Films available for deposition
We offer a wide variety of E-Beam evaporation precious and non-precious metals. Non-precious metals and dielectric materials are available for sputtering.

Metals Available
  • Aluminum
  • Chromium
  • Copper
  • Gold
  • Indium Tin oxide
  • Platinum
  • Nickel
  • Silver
  • Titanium
  • Tin

MSDS Available

Materials Safety Data Sheets Available Upon request

Glass Materials!

  • Soda Lime
  • Borofloat 33
  • Bk7 Glass
  • Fused Silica
  • Single Crystal Quartz