Call 800-713-9375

Order!

E-Beam Evaporated Metals

Our E-Beam evaporation process provides excellent film thickness control and can deposit up to six different materials in-situ. E-Beam evaporation is often used when precious metals deposition is required and is an excellent choice for wafers that require lift-off processing.

 

In order to ensure the best results for metal lift-off, the underlying wafer and photoresist must be kept cool during metal deposition. This can be difficult to achieve while depositing thick layers. We along with our partners Microdevices has developed a specialized low temperature E-Beam evaporation process specifically for use during metal lift-off processing.

The surface preparation of patterned silicon and quartz wafers intended for lift-off metal is also extremely important. We include photo-resist bake and O2 descum steps just prior to deposition to improve film adhesion.

Films available for deposition

We offer a wide variety of E-Beam evaporation precious and non-precious metals. Non-precious metals and dielectric materials are available for sputtering.

 

Metals Available

 

Fill out the Form Below for a Fast Quote!

Submitting Form...

The server encountered an error.

Form received.