Call 800-713-9375

Order!

Sputtered Metals

 

We understand how important quality is to you. Our sputter process has been designed to deposit ultra-clean metal and dielectric films. All wafer processing, including metal deposition, is performed inside our class 100 clean-room. An in-situ RF etch is added to the process to insure good film adhesion and ohmic contact to underlying conductive layers.

 

In addition to an In-situ RF etch, we can provide an HF-dip just prior to sputtering aluminum and aluminum alloy films. Adding this additional step can further increase ohmic contact between layers.

 

Sputtered metal deposition is an omni-directional process. For this reason, sputter deposition is not a good candidate for Lift-Off processing. If you are interested in metal for Lift-Off processing please see our E-beam evaporation metals page.

 

All sputter films are available on silicon wafers sizes up to 300mm in diameter. We can also provide sputtered films on non-silicon materials, including quartz and glass wafers.

We offer a wide variety of sputtered non-precious metals, dielectric films, and silicon. Precious metals are available for E-Beam evaporation.

 

Fill out the Form Below for a Fast Quote!

Submitting Form...

The server encountered an error.

Form received.

Our most popular Sputtered Films include:

 

 

Thickness range: 100Å-1.5µm depending on metal

Thickness tolerance: +/-10%

Sides processed: One

Wafer size: 2″ – 12″

Gases: Argon, Nitrogen

Equipment: Sputter deposition too